Stamp assembly and stamp unit including the stamp assembly and a perforation device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 21, 1997
Grant Date -
N/A
app pub date -
Nov 22, 1995
filing date -
Dec 22, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A guide hole 18 is formed in a left side wall 17 of a grip 2 provided to a stamp assembly 1. When the stamp assembly 1 is mounted to a thermal perforation unit 50, a guide bar 38 provided to the thermal perforation unit 50 is inserted into the guide hole 18. A protector clasp 18a for opening and closing the guide hole 18 is provided to the left side wall 17. The protector clasp 18a can be manually slid up and down in a protector clasp groove 17a. When the protector clasp 18a is in a lower position shown in FIG. 1 (a), the guide hole 18 is closed so that the stamp assembly 1 can not be mounted to the thermal perforation unit 50. When the protector clasp 18a is in an upper position shown in FIG. 1 (b), the guide hole 18 is closed so that the stamp assembly 1 can be mounted to the-thermal perforation unit 50.
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