Composition dispensable at high speed for bonding electric parts to printed wiring boards
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United States of America Patent
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Dec 17, 1996
Grant Date -
N/A
app pub date -
Mar 29, 1995
filing date -
Mar 31, 1994
priority date (Note) -
Expired
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Abstract
A liquid epoxy resin composition is disclosed which comprises a liquid epoxy resin, an amine curing agent, an inorganic filler such as calcined talc, and an organic rheology additive such as modified castor oil. The epoxy resin composition having not greater than 0.4 of an R-value defined by the following equation: R=.eta..sub.10 /Sc wherein .eta..sub.10 is a viscosity in Pa.s of the composition at a rate of shear of 10 sec.sup.-1 and Sc represents a Casson yielding point shows excellent adaptability to a high speed dispenser.
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