Aluminum-palladium alloy for initiation of electroless plating
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United States of America Patent
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Dec 3, 1996
Issued Date -
N/A
app pub date -
Jan 12, 1995
filing date -
Jul 15, 1993
priority date (Note) -
Expired
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Abstract
Thin layers of aluminum (13) and palladium (12) are deposited and annealed to produce aluminum-palladium alloy (14). The surface of the alloy (14) is exposed and treated with an aluminum etchant to produce a catalytic surface (15). The catalytic surface is used for electroless plating of nickel, providing excellent plating uniformity and adhesion, as well as a reduced plating induction time. Several variants of the basic method are possible.
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