Dip coating method
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United States of America Patent
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-
Nov 26, 1996
Grant Date -
N/A
app pub date -
Jun 6, 1995
filing date -
Jun 6, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed a dip coating method for fabricating a photosensitive member employing a substrate which defines a top non-imaging portion, a middle imaging portion, and a bottom non-imaging portion, wherein the method comprises: (a) immersing the bottom non-imaging portion, the middle imaging portion, and optionally a part of the top non-imaging portion of the substrate in a coating solution; (b) raising the middle imaging portion out of the coating solution; and (c) raising the bottom non-imaging portion out of the coating solution at a take-up speed which is decreasing from the take-up speed of the substrate at the junction between the middle imaging portion and the bottom non-imaging portion, thereby reducing the size of any bead on the bottom non-imaging portion.
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