Gas supplying head and load lock chamber of semiconductor processing system
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United States of America Patent
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-
Nov 26, 1996
Issued Date -
N/A
app pub date -
Aug 17, 1995
filing date -
Mar 17, 1993
priority date (Note) -
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Abstract
An etching system for processing a semiconductor wafer has a processing chamber and a load lock chamber. The load lock chamber includes an airtight casing having openings through which the wafer is transferred, and each of the openings is openably and airtightly closed by a gate valve. A transfer arm for carrying the wafer is provided within the casing. A gas supplying system for supplying an inert gas and an exhausting system are connected to the casing. A gas supplying head is connected to the inner end of the gas supplying system, and has an outlet filter which is made of a porous ceramic plate formed into a cylinder. The porous ceramic plate has a multi-layer structure consisting of supporting, intermediate and filtering layers. The average pore diameter of the filtering layer is from 0.8 .mu.m to 0.1 .mu.m, and the porosity thereof is from 10% to 50%.
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