Method of manufacturing a coin detector
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United States of America Patent
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-
Nov 19, 1996
Issued Date -
N/A
app pub date -
Mar 24, 1995
filing date -
Jun 3, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Coin detector may be manufactured in several steps. An integrated circuit board (ICB) having conductive material on its surface is covered with an etching mask where conductive elements are to be located. The unmasked portion of the ICB surface is etched off, and then the etching mask is removed. The ICB substrate is attached with a detector circuit located on an etched portion of the ICB surface. An oscillator circuit is connected to a conductive coil. If the coin detector uses a two-layer coil, the coils are connected by a through-going board. The structure is encased in a synthetic material.
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