Apparatus for fabricating multilayer structures
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United States of America Patent
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Nov 12, 1996
Issued Date -
N/A
app pub date -
Jun 5, 1995
filing date -
Jun 12, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of fabricating a plurality of multilayer structures which includes at least one recess defined by a nonplanar surface. The method comprising the step of: (a) providing a resilient, compliant material on over one or more stacks of layers including the area over the recess; (b) applying sufficient pressure to the stacks to cause the resilient, compliant material to fill the recess and laminate said stacks; (c) lifting the resilient, compliant material off the stack subsequent to the application of pressure; (d) providing one or more stacks of layers that have not been subjected to step (b); and (e) repeating steps (a)-(d). In a preferred embodiment of the invention steps (a)-(d) are repeated at least ten times without the need to change the resilient compliant material. In a most preferred embodiment of the invention steps (a)-(d) are repeated at least one hundred times.
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