Apparatus for measuring, thinning and flattening silicon structures
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United States of America Patent
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Oct 8, 1996
Grant Date -
N/A
app pub date -
Sep 13, 1994
filing date -
Sep 13, 1994
priority date (Note) -
Expired
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Abstract
A system is provided for processing wafers, such as silicon and silicon-on-insulator wafers. The processing includes thinning and flattening of the wafers at a work station located directly beneath a down looking metrology apparatus for directing light onto the wafer and measuring the light wavefronts reflected from the wafer. The metrology apparatus for flattening includes the feature of a multiple lens array for arranging the reflected wavefronts into a plurality of light spots, and a charge-coupled-device light responsive device for receiving the light spots and determining the shape of the wavefronts. The system also provides a wafer transport system for moving one or more wafers into one or more work stations beneath the metrology apparatus in a vacuum chamber.
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