Transportable object and process of production
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United States of America Patent
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Oct 8, 1996
Issued Date -
N/A
app pub date -
Apr 6, 1994
filing date -
Apr 6, 1993
priority date (Note) -
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Abstract
A transportable object having, in a plastic support, a cavity for receiving a micromodule unit containing a conductive chip with zones electrically insulated from one another and to which is electrically connected an integrated semiconductor circuit having at least a storage function. The cavity has a contour shaped in a sequence of contiguous arcs of small amplitude relative to a median contour line of a shape matched to the shape of the chip. The contour of the cavity forms a clearance angle of 10 degrees relative to a direction perpendicular to the surface of support.
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