Method for connecting electronic circuits in a multi-chip module having a co-fired substrate and multi-chip module obtained thereby
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United States of America Patent
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Oct 8, 1996
Grant Date -
N/A
app pub date -
Feb 8, 1995
filing date -
Feb 10, 1994
priority date (Note) -
Expired
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Abstract
The multi-chip module comprises a co-fired substrate, and, on at least ont face of the substrate, a set of superimposed ceramic insulating layers, fired at a temperature substantially smaller than the firing temperature of the substrate. Conducting interconnection lines are formed in thick layers deposited between said ceramic insulating layers. Electronic components are mounted at the surface of the set of ceramic layers.
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