Vertical grounded coplanar waveguide H-bend interconnection apparatus
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United States of America Patent
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Oct 1, 1996
Grant Date -
N/A
app pub date -
Jun 5, 1995
filing date -
Jun 5, 1995
priority date (Note) -
Expired
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Abstract
Interconnection apparatus providing a right angle H-plane bend in grounded coplanar waveguide (GCPW) transmission line media. Respective first and second GCPW lines include a dielectric substrate, on which is formed on a bottom surface a bottom conductive ground plane, and on a top surface is formed a center conductor strip sandwiched between first and second top ground plane strips. The two GCPW lines are disposed orthogonally, forming a corner junction at which corresponding bottom and top ground planes, and the center conductor strips, of the lines are electrically connected. The gaps between corresponding top ground plane strips and the center conductor strips have regions of increased gap width at the corner junction to compensate for the capacitance resulting from the junction.
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