Phenolic resin compositions derived from bisphenol compounds and their condensates

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United States of America Patent

PATENT NO 5552509
SERIAL NO

08114081

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Abstract

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A phenolic resin composition herein disclosed comprises, as essential components, (i) at least one phenol resin A selected from the group consisting of residues formed through purification of bisphenol A, residues obtained by cleaving the bisphenol A-purification residue, condensates of the bisphenol A-purification residue obtained by reacting the bisphenol A-purification residue with formaldehyde and condensates of the cleavage residue obtained by reacting the cleavage residue with formaldehyde, and (ii) at least one phenolic resin B selected from the group consisting of high-boiling fraction obtained through production of bisphenol F and condensates of the high-boiling fraction obtained by reacting the high-boiling fraction with formaldehyde. The phenolic resin composition can be used in making resin-coated sand particles which do not give out a bad smell and do not generate any soot and smoke during forming a mold by the shell molding method and which have good disintegration properties without using any sand-baking process.

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Patent Owner(s)

Patent OwnerAddress
MITSUI TOATSU CHEMICALS INC2-5 KASUMIGASEKI 3-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iimuro, Shigeru Aichi, JP 30 364
Kitamura, Takashi Kanagawa, JP 129 1930
Takashima, Tomoko Aichi, JP 2 8

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