Palladium bonding wire for semiconductor device
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United States of America Patent
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Jul 23, 1996
Issued Date -
N/A
app pub date -
May 30, 1995
filing date -
Jun 4, 1990
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Abstract
A bonding wire for a semiconductor device contains high purity Pd or Pd alloy as a base metal and 25-10000 atppm of low boiling element III having a boiling point lower than a melting point of the base metal and soluble in Pd, or contains high purity Pd or Pd alloy as a base metal and 5-500 atppm of low boiling point element IV having a boiling point lower than a melting point of the base metal and insoluble in Pd, or high purity Pd or Pd alloy as a base metal, and 5-10000 atppm of low boiling point element III and low boiling point element IV, the low boiling point element III having a boiling point lower than a melting point of the base metal and being soluble in Pd, the low boiling point element IV having a boiling point lower than a melting point of the base metal and being insoluble in Pd, the low boiling elements III and IV being present in a concentration so that (content of the low boiling point element III)/25 + (content of the low boiling element IV)/5.gtoreq.1.gtoreq. (content of the low boiling element III)/10000 + (content of the low boiling element IV)/500. The low boiling point elements III and IV may be replaced by low boiling point element I soluble in Au and low boiling point element II soluble in Au, respectively.
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