Wood preservation method and wood preservative

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United States of America Patent

PATENT NO 5538670
SERIAL NO

08232100

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Abstract

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The invention concerns a method and a preservative for protecting wood against decay. According to the method wood is treated with a wood preservative capable of preventing the growth and spread of fungi, said preservative containing at least one complexing agent which binds at least a portion of those metals, typically iron and manganese, naturally occurring in wood that are essential to the growth of fungi. The complexing agents employed can be, e.g., ethylenediaminetetra-acetate, ethylene diamine-di-o-hydroxyphenylacetate a polyphospate or a siderophore produced by a microorganisms. The wood preservative used in the method is water-borne and specific to the decay fungi attacking wood.

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Patent Owner(s)

Patent OwnerAddress
METSÄLIITTO OSUUSKUNTA02020 METSÄ
KOSKISEN OY16600 JÄRVELÄ
KYMMENE OYMIKONKATU 15A FIN-00100 HELSINKI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mattila-Sandholm, Tiina Espoo, FI 1 2
Paajanen, Leena Helsinki, FI 2 4
Ritschkoff, Anne-Christine Helsinki, FI 3 9
Viikari, Liisa Helsinki, FI 28 274

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