Method of making electroconductive adhesive particles for Z-axis application
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United States of America Patent
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Jul 2, 1996
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N/A
app pub date -
Jun 16, 1994
filing date -
Jun 16, 1994
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Abstract
Electroconductive resin adhesive particles are incorporated in a dielectric-resin-adhesive-containing carrier to form a Z-axis adhesive. Particles are preferably produced by printing techniques or by in-fluid forming techniques, the latter being particularly suited for the formation of substantially spherical particle shapes. The particles also have use as discrete adhesive members.
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