Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths
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United States of America Patent
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Jun 18, 1996
Issued Date -
N/A
app pub date -
Dec 19, 1994
filing date -
Feb 14, 1992
priority date (Note) -
Expired
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Abstract
A process and apparatus for producing supported conductive networks which can be flexible or rigid, having densely packed circuits. The process and apparatus for making the conductive network involves forming a conductive material supported on a 'dynamic pressure cushion' into a non-planar pattern defining the desired conductive circuits in relation to a fixed reference plane. The 'dynamic pressure cushion' is a material having suitable viscosity and flow characteristics to flow out from under the conductive material as it is being formed and fill up any voids. To ensure that the 'dynamic pressure cushion' properly flows without deforming the desired circuits, the die used to form the conductive material is provided with a material flow control grid and material expansion troughs. After forming the unwanted material is then mechanically removed in dimensional relation to the reference plane leaving the desired conductive circuits.
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