Pressure-sensitive adhesive systems with filler

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United States of America Patent

PATENT NO 5527595
SERIAL NO

08283359

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Abstract

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There is provided an adhesive system comprised of a pressure-sensitive adhesive matrix having dispersed therein organic particulate solids having a particle size no greater than 300 microns, and generally no greater than 225 microns, which matrix may have at least one, and generally two, sides coated with an unfilled pressure-sensitive adhesive material, which adhesive materials generally may be acrylic materials. Such adhesive system is one generally provided as a sheet, including elongated tapes, having a thickness of from about 25 to 60 mils.

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Patent Owner(s)

Patent OwnerAddress
ALLIEDSIGNAL TECHNOLOGIES INC8440 S HARDY DRIVE CITY TEMPE AS 85284

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Slovinsky, Manuel Sao Paulo, BR 14 228
Tarizzo, Jeffrey R Tacoma, WA 3 49

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