Internal soldering in metal/ceramic composites
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United States of America Patent
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Jun 11, 1996
Grant Date -
N/A
app pub date -
Jun 10, 1994
filing date -
Jun 12, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to a composite body in which a ceramic component and a metal component are bonded to one another by internal soldering. The internal soldering is effected with soldering composition in a recess (2) within a component (1) of the one material in which there is arranged a component (3) of the other material which is shaped to fit accurately. The recess (2) is, at at least one end-face opening, surrounded by a chamfer (5) having an angle .phi. smaller than 35.degree. C., while the wetting angle .beta. between the soldering composition and the plane of the component surface in which the recess is located is smaller than 40.degree..
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