Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication
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United States of America Patent
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-
Jun 4, 1996
Grant Date -
N/A
app pub date -
Jan 10, 1995
filing date -
Jan 12, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A laminar board for printed circuits is described, consisting of a base layer (1) made of a material with a high coefficient of thermal conduction and, on at least one side (1B) of the base layer, a coating (13) of electrically insulating material forming the surface for the application of the conducting tracks (11) of the printed circuit. The base layer (1) has at least one deformed area with a depression (3A) on one side (1A) and a corresponding projection (3B) on the opposite side (1B), the insulating coating (13) being applied to the side (1B) on which the projection (3B) is disposed, forming a surface substantially free of discontinuities, with a lesser thickness at the position of the projection (3B) and a greater thickness in the areas adjacent to the projection; the power components (15) of the circuit are fitted over the projection (3B).
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