Surface-mount flat package semiconductor device
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United States of America Patent
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May 28, 1996
Grant Date -
N/A
app pub date -
Nov 23, 1994
filing date -
Nov 25, 1993
priority date (Note) -
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Abstract
A surface mount flat package for a semiconductor device includes a number of leads on a lead frame. At least one of the leads is straight with a thick section and a thin section. Part of the thin section is inside a protective medium and part extends outside. A bottom surface of the part extending outside the protective medium serves as a connection terminal for the semiconductor device. Another lead is an island lead that has a bonding island on an upper surface thereof. The island lead has a thick section and a thin section. The bonding island is on the thin section. The thin section is entirely within the protective medium. A bottom surface of the thick section is exposed outside the protective medium to serve as a connection terminal. The bottom surfaces of the thick sections are coplanar with each other and preferably coplanar with a bottom surface of the package.
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