Mutlilayered antifuse with intermediate metal layer
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United States of America Patent
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May 7, 1996
Grant Date -
N/A
app pub date -
Mar 31, 1994
filing date -
Mar 31, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An antifuse structure in an integrated circuit including a first interconnection line, a second interconnection line formed over the first interconnection line, and a plurality of programming layers between the first and second interconnection lines. Each pair of programming layers has a metal layer therebetween which dissolves with the programming layers to form a conducting link during the programming of such antifuse structure. Such antifuse structure may also include a conductive plug between the programming layers and the second interconnection line.
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