Apparatus for selectively electroplating apertured metal or metallized products
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United States of America Patent
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Apr 30, 1996
Grant Date -
N/A
app pub date -
Jan 27, 1994
filing date -
Jan 28, 1993
priority date (Note) -
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Abstract
The invention relates to an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.
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