Solderless solenoid assembly for use in an electrical signaling device
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United States of America Patent
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Apr 16, 1996
Grant Date -
N/A
app pub date -
Jun 21, 1993
filing date -
Jun 21, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A solderless solenoid assembly, preferably for use in an electrical signaling device. The solenoid assembly is formed by wrapping conductive wire around a bobbin, forming a solenoid coil. A plurality of terminal displacement slots are attached to the bobbin. The lead wires of the coil are terminated in the bobbin terminal displacement slots. Electrical connectors are placed in each of the terminal displacement slots. The entire solenoid assembly snaps into a solenoid coil support bracket. The solenoid coil support bracket is then secured to a base which is connected to an electrical signaling device.
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