Lead frame taping machine

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5507910
SERIAL NO

08226558

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The object of the present invention is to provide a lead frame taping machine, which is capable of waiting the fade at a position away from a lead frame holding section and preventing the punch from shaking when the tape-chip is taped onto the lead frame. The lead frame taping machine of the present invention comprises: a lead frame holding section for holding a lead frame; a die plate for holding a tape to be punched, the die plate being provided away from the lead frame holding section and having a through punch-hole; a punch being provided away from the die plate, the punch being capable of moving to and away from the lead frame holding section through the through punch-hole whereby the punch is capable of punching the tape and pressing a tape-chip, which has punched off from the tape, onto the lead frame; and a driving mechanism for moving the punch. The die plate is capable of moving between a first position which is separate away from the lead frame holding section and a second position which is close thereto, the die plate is moved to the second position when the punch punches off the tape and presses the tape-chip onto the lead frame.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
APIC YAMADA CORPORATION90 OOAZA KAMITOKUMA CHIKUMA-SHI NAGANO 3890898 ?3890898

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyajima, Fumio Togura, JP 21 494

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation