Nitrogen based low temperature direct bonding
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United States of America Patent
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Apr 2, 1996
Issued Date -
N/A
app pub date -
Jun 8, 1994
filing date -
Jan 6, 1993
priority date (Note) -
Expired
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Abstract
A process for direct bonding similar or dissimilar materials at low temperatures in which a material surface is rendered hydrophilic and reactive by creating nitrogen based radicals on the surface, the surface is direct bonded to a second surface, and the bonded surfaces are annealed at a temperature below approximately 500.degree. C. A nitrogen based constituent is combined with an activator to render the surface hydrophilic and reactive through ammonia plasma activation or activation by use of hydrofluoric acid.
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