Temperature management for integrated circuits
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United States of America Patent
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Mar 26, 1996
Grant Date -
N/A
app pub date -
Apr 28, 1994
filing date -
Apr 28, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system for controlling temperature buildup in an IC employs a temperature sensor to provide an indication of the IC temperature to a control circuit which is configured to provide an operational clock rate to the IC which is less than the system clock rate, based on a function of the temperature of the IC or its package. In one embodiment temperature sensors are implemented as solid-state circuitry within different functional areas of a single IC, such as a microprocessor, In other embodiments, operating voltage is lowered as operating frequency is lowered. In yet another embodiment temperature sensing of multiple processors in a system is provided to a controller or controllers which are configured to allocate workload between the processors as a means to limit temperature rise, as well as to lower operational clock rate and to lower operating voltage.
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