Method of manufacturing corrugated board using a thermal radiant energy source

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5498304
SERIAL NO

08190146

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Corrugated paperboards are prepared for corrugation and adhesive bonding of mediums and liners by exposing the mediums liners and adhesives to radiant energy from a thermal source ranging from 1100.degree. C. to 2300.degree. C. and emitting a dominant wavelength in the range of 2.1 to 1.0 microns. The speed of adhesive bond development is increased. Polymeric adhesives may be used as alternatives to conventional starch based adhesives.

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Patent Owner(s)

Patent OwnerAddress
AMCOR LIMITED109 BURWOOD ROAD BLOOMFIELD HILLS 3122

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mutimer, Frederick J Lower Plenty, AU 1 10
Padanyi, Zsolt V Nunawading, AU 1 10
Shaw, Neil W Ivanhoe, AU 4 123

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