LC element and semiconductor device having a signal transmission line and LC element manufacturing method

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United States of America Patent

PATENT NO 5497028
SERIAL NO

08335420

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Abstract

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An LC element and an semiconductor device comprising a second electrode having a predetermined shape formed in direct contact with the surface of a semiconductor substrate, and a first electrode having a predetermined shape formed interspaced by an insulation layer on the semiconductor substrate surface; and a method of manufacturing the LC element. A channel formed along the first electrode on application of a predetermined gate voltage to a control electrode connected to the first electrode and the second electrode respectively function as inductors, while a distributed constant type capacitor is also formed between these; and by using the channel as a signal transmission line, the LC element and a semiconductor device give excellent attenuation characteristics. The LC element and semiconductor device are easily manufactured, while parts assembly work in subsequent processing can be abbreviated, formation as a portion of an IC or LSI device is possible, and characteristics can also be controlled.

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Patent Owner(s)

Patent OwnerAddress
NIIGATA SEIMITSU CO LTD5-13 NISHISHIROCHO 2-CHOME JOETSU-SHI NIIGATA 943-0834

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Takeshi 2-5-6-213, Sanno, Ohta-Ku, Tokyo, JP 331 3847
Okamura, Susumu 4-1-12-1305, Hiroo, Shibuya-ku, Tokyo, JP 57 482

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