Epoxy resin composition containing alkylated hydroquinone epoxide
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United States of America Patent
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Feb 27, 1996
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N/A
app pub date -
Apr 6, 1994
filing date -
Apr 16, 1993
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Abstract
An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).
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