Electrical access for electrical lapping guides
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United States of America Patent
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Feb 27, 1996
Grant Date -
N/A
app pub date -
Jul 7, 1993
filing date -
Jul 7, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a new method and apparatus for electrically accessing a lapping sensor positioned along a row of slider sites on a wafer. The apparatus for accessing the lapping sensor may be positioned outside of the boundaries of the slider sites. The apparatus may also provide top conductors electrically connecting target pads to contact pads. The process for lapping rows of slider sites includes coupling a measurement device to a target pad, coupling a lapping sensor to the top conductor, and lapping the row until the measurement device detects a predetermined signal from the lapping sensor.
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