Plastic-packaged semiconductor device having a heat sink matched with a plastic package
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United States of America Patent
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Feb 20, 1996
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N/A
app pub date -
Nov 26, 1993
filing date -
Nov 26, 1992
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Abstract
In a plastic-packaged semiconductor device molded by a synthetic resin, a heat sink is formed by a sheet which has a thermal expansion coefficient between 9.0.times.10.sup.-6 /K and 23.times.10.sup.-6 /K and a thermal conductivity greater than 200 W/m.multidot.K, which are selected in relation to those of the synthetic resin. The sheet is manufactured by mixing a first metal of a high melting point with a second metal of a low melting point lower than the first metal and by pressing and sintering the mixture. The first and the second metal may be molybdenum and copper, respectively. Alternatively, the sheet may be a composite sheet composed of a molybdenum mesh interposed between a pair of aluminum layers or a stacked sheet composed of a sintered layer of a mixture of molybdenum and copper and a coated layer of either molybdenum or copper.
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