Thermoplastic molding resin composition
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United States of America Patent
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Feb 20, 1996
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N/A
app pub date -
Oct 7, 1993
filing date -
Oct 12, 1992
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Abstract
Thermoplastic molding resin composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.
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