Resin compositions, production process thereof, and products using the resin compositions
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United States of America Patent
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Feb 20, 1996
Issued Date -
N/A
app pub date -
Jul 10, 1995
filing date -
Sep 8, 1992
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Abstract
A resin composition comprises 100 parts by weight of an ethylene-base resin comprising at least 2 wt. % of linear low-density polyethylene and 0.1-30 parts by weight of an organopolysiloxane having an average molecular weight of at least 100,000. The resin composition can be produced by melting and kneading the organopolysiloxane together with the linear low-density polyethylene and then melting and kneading the resulting polymer blend together with the ethylene-base resin other than the linear low-density polyethylene. The resin composition may additionally comprise 0.1-100 parts by weight of a propylene-base resin. In the latter resin composition, the organopolysiloxane is contained in an amount of 0.1-30 parts by weight per 100 parts by weight of the sum of the ethylene-base resin and the propylene-base resin. The latter resin composition can be produced by melting and kneading the organopolysiloxane together with the propylene-base resin and then melting and kneading the resulting polymer blend together with the ethylene-base resin. Optical fiber feeding pipes and optical fiber units making use of such resin compositions are also described.
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