Packaging architecture for phased arrays
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 30, 1996
Issued Date -
N/A
app pub date -
Sep 20, 1993
filing date -
May 24, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A dipole antenna is inserted into a waveguide to couple EM energy into and out of a waveguide. The dipole antenna is printed on a substrate of a module that contains electronic components. The substrate includes a coupled coplanar strip transmission line connecting the dipole antenna to a slotline. EM energy is electromagnetically coupled between the slotline and a microstrip transmission line. The EM energy is provided to and from the hermetically sealed electronic components by the microstrip transmission line.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully