Means for clamping a semi-conductor to a support
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United States of America Patent
Stats
-
Jan 9, 1996
Grant Date -
N/A
app pub date -
Feb 24, 1994
filing date -
Feb 24, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus is presented herein for resiliently clamping at least one semi-conductor device to a support having an upper surface and wherein the semi-conductor device includes a housing having upper and lower spaced-apart relatively flat surfaces interconnected by an upstanding cylindrical wall. A leveller is provided having an upper dome-shaped contact surface and a lower surface having a circular-shaped first recess formed therein. The first recess is shaped and is of sufficient size to receive the upper portion of the housing including the upper surface thereof and a portion of the height of the cylindrical wall while the lower surface of the housing is located on the upper surface of the support. An elongated spring overlies and is resiliently biased toward and engages the dome-shaped contact surface of the leveller. A fastener secures the spring to the support such that the spring exerts a resilient force against the dome-shaped contact surface of the leveller to resiliently clamp the semi-conductor device against the upper surface of the support.
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Cited Art Landscape
Patent Citation Ranking
- 17 Citation Count
- H01L Class
- 42.86 % this patent is cited more than
- 29 Age