Method of preventing deformation of lead frames

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United States of America Patent

PATENT NO 5475918
SERIAL NO

08307006

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.

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Patent Owner(s)

Patent OwnerAddress
ELECTROPLATING ENGINEERS OF JAPAN LIMITEDTOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kubota, Tsuneo Hiratsuka, JP 1 49
Taniguchi, Kazuhiro Hiratsuka, JP 31 287

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