Importance

Loading Importance Indicators...

Abstract

A reusable test socket is described for testing singulated bare die to determine, before packaging, that the bare die is a 'known good die'. The socket contains a circuit pad pattern in the mirror image of the bond pad pattern of the bare die to be tested. Each pad of the socket contains a conductive elastomeric probe which has been 'screened' onto the bond pad. The socket also contains an alignment template for orienting the bare die onto the elastomeric probes of the pad pattern of the test socket. Additionally, the socket can be a singular piece or it can be made of two main pieces; the first being a socket, and the second being a test board designed to mate with the socket. Further, the socket can be utilized in conjunction with a clamp for holding the bare die in place and with a thermoelectric cooler. The thermoelectric cooler is used to heat or cool the die at all temperatures required for military certification and other extended temperature applications. The disclosed invention also includes a method of using the reusable test socket which includes the steps of placing the bare die onto the test socket, placing the socket into electrical continuity with test equipment, conducting tests at ambient temperatures, subjecting the die to a prolonged period of 'burn-in' at elevated temperatures, conducting further electrical tests at various temperatures, and determining whether the bare semiconductor die is a 'known good die'.

Loading the Abstract Image...

First Claim