Semiconductor memory component comprising stacked memory modules
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 5, 1995
Grant Date -
N/A
app pub date -
Feb 2, 1994
filing date -
Feb 2, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A memory component has a rectangular semiconductor substrate containing active memory circuits and output terminals on a major surface thereof. An insulating layer on the major surface receives a plurality of metal connection leads, connecting the output terminals to connection pads located on the major surface along only one of longer sides of the substrate. A plurality of additional pads are distributed between the connecting pads and are devoid of connection leads. A memory module comprising several stacked memory components is also described, which uses the additional pads as relays.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully