Resin molded type semiconductor device having a conductor film
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United States of America Patent
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Nov 21, 1995
Issued Date -
N/A
app pub date -
Aug 22, 1994
filing date -
Sep 1, 1980
priority date (Note) -
Expired
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Abstract
A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.
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