Mark of an electronic component lid
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United States of America Patent
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Nov 14, 1995
Grant Date -
N/A
app pub date -
Feb 14, 1994
filing date -
Feb 14, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of combining a metal component and a base metal of an article to form a pattern of the article. The method comprises applying the metal component to a carrier, the metal component shaped like the pattern; placing the metal component against the base metal; and supplying heat such that the base metal and the metal component alloy.
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