Dual sided laminated semiconductor mounting
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 31, 1995
Issued Date -
N/A
app pub date -
Feb 28, 1994
filing date -
Feb 5, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for carrying semiconductor mounting devices in back-to-back arrangement is disclosed in which a central substantially planar thermally conductive support member is provided with recesses in its top and bottom surfaces of an interlocking congruent shape with the semiconductor devices to be received such that each semiconductor mounting device assembled therein is positively positioned and locked in place and fixed in a manner such that the semiconductor elements mounted on the layered or laminar elements connect directly to circuitry carried on the surfaces of the support member.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully