Enclosure for an electronic circuit module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 24, 1995
Grant Date -
N/A
app pub date -
Feb 22, 1994
filing date -
Feb 22, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An enclosure for protectively housing a printed circuit board in an electronic circuit module includes a base having an internal surface and an external surface. The base includes a pair of raised mounting pads formed on the internal surface which define respective mounting surfaces. A pair of channels are also formed on the internal surface of the base. The enclosure further includes a cover having a panel portion and a pair of end wall portions. Respective projections are formed on each of the end wall portions which define grooves therein. The cover is assembled to the base by inserting the edges of the end wall portions provided on the cover into the channels provided on the base. A plurality of spring clips is disposed within each of the grooves provided on the cover. The spring clips can be positioned at any desired location along each of the grooves. When the cover is connected to the base, the spring clips urge electrical components mounted on the printed circuit board into abutment with the mounting pads provided on the base. As a result, a firm mechanical engagement is maintained between the electrical components and the mounting pads. The mounting pads conduct heat generated by electrical components away therefrom for dissipation.
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