Power semiconductor module having a plurality of semiconductor arrangements
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United States of America Patent
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Oct 17, 1995
Issued Date -
N/A
app pub date -
Feb 16, 1995
filing date -
Aug 26, 1992
priority date (Note) -
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Abstract
A plurality of semiconductor arrangements arranged on interconnects are cected parallel to one another in a module. The arrangements lie opposite one another in pairs. At least one pair and at most two pairs of semiconductor arrangements are arranged to follow one another in the direction of an axis of the module and are further connected to lead conductors. Positions of the lead conductors with respect to the contacted semiconductor arrangements are the same for each pair of semiconductor arrangements or, respectively, two respective pairs of semiconductor arrangements. Corresponding lead conductors are connected to one another above the interconnects.
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