Alloy powder, dispersion-type conductor using the same
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United States of America Patent
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Oct 17, 1995
Grant Date -
N/A
app pub date -
Jun 24, 1993
filing date -
Jun 30, 1992
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Abstract
Alloy powder which is low in price and is unlikely to be oxidized on the surface, and a dispersion-type conductor using the alloy powder in which electromigration is not likely to occur. Melt of copper and silver is cooled at a high cooling speed of 10.sup.5 .degree. C./s or higher. Alloy powder having a composition expressed by a chemical formula Cu.sub.x Ag.sub.1-x (where 0.80.ltoreq.X.ltoreq.0.99) is obtained. Also, a dispersion-type conductor is produced by dispersing 100 parts by weight of the alloy powder in between 5-100 parts by weight of a binder. Thus, the low-priced alloy powder and the dispersion-type conductor of high quality and high reliability can be obtained.
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