Method for the through plating of conductor foils
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United States of America Patent
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Oct 17, 1995
Grant Date -
N/A
app pub date -
Jan 25, 1994
filing date -
Jan 26, 1993
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Electrical connections in multilayer printed circuit boards made from conductor foils are preworked by producing preworked electrical connections on the conductor foils to be subsequently processed and for this purpose photoresist is laminated onto said conductor foils, in such a way that in a photochemical process a freely selectable pattern of recesses in the photoresist is exposed and developed, that in a galvanic plating process metal is plated in said recesses and the photoresist is subsequently removed, that at least two conductor foils are pressed, in such a way that the conductor foils are separated by at least one intermediate adhesive film or foil and that each adhesive foil is laminated onto at least one conductor foil, each of said intermediate adhesive foils engaging on at least one conductor foil with preworked electrical connections in such a way that on pressing at least two conductor foils the electrical connections preworked on at least one of the conductor foils penetrates the intermediate adhesive foil and electrical connections are formed between said conductor foils.
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