Injection mold probe and runnerless injection mold
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 10, 1995
Grant Date -
N/A
app pub date -
Feb 15, 1994
filing date -
Feb 16, 1993
priority date (Note) -
Expired
status (Latency Note)
![]() |
A preliminary load of PAIR data current through [] has been loaded. Any more recent PAIR data will be loaded within twenty-four hours. |
PAIR data current through []
A preliminary load of cached data will be loaded soon.
Any more recent PAIR data will be loaded within twenty-four hours.
![]() |
Next PAIR Update Scheduled on [ ] |

Importance

US Family Size
|
Non-US Coverage
|
Patent Longevity
|
Forward Citations
|
Abstract
An injection mold probe and a runnerless injection mold, in which the injection mold has a tip heater for intermittently heating a tip portion of the probe and a body heater for heating a body portion of the probe. The heaters being furnished with power from a single power source. The injection mold probe has its tip portion provided with a tip heater, which is made of platinum or a platinum alloy with the electric resistance thereof increased quickly with temperature increase caused by energization and its body portion provided with a body heater, which is made from a nicrome wire with the electric resistance thereof less increased with temperature increased caused by energization, the tip and body heaters being connected in series. The probe is mounted in a runner portion of a die with its tip portion disposed near a gate portion of the die. The runnerless injection mold comprises a power source unit for controlling power in synchronism to a molding process to serially supply power to the tip and body heaters.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SEIKI KABUSHIKI KAISHA | TOKYO |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Shindo, Hiraku | Yonezawa, JP | 2 | 42 |
# of filed Patents : 2 Total Citations : 42 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 20 Citation Count
- B29C Class
- 54.68 % this patent is cited more than
- 30 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Nov 12, 2003 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Oct 10, 2003 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Oct 10, 2003 |
Oct 10, 2003 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Apr 09, 1999 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Dec 02, 1998 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
Oct 10, 1995 | I | Issuance | |
Feb 15, 1994 | F | Filing | |
Jan 31, 1994 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SHINDO, HIRAKU;REEL/FRAME:006885/0916 Owner name: SEIKI KABUSHIKI KAISHA, JAPAN Effective Date: Jan 31, 1994 |
Feb 16, 1993 | PD | Priority Date |

Matter Detail

Renewals Detail
