Method and apparatus for cooling sensors in high temperature environments
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United States of America Patent
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-
Sep 19, 1995
Grant Date -
N/A
app pub date -
Dec 14, 1992
filing date -
Dec 14, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Sensor assemblies, comprising one or more sensors for use in high-temperature environments such as an aircraft wing, include a thermally conductive retaining member in thermal communication with either the sensor or the environment surrounding the sensor. A housing assembly placed proximate to, and in thermal communication with, the retaining member defines a fluid passageway. During operation, fluid circulates through the housing to enhance the transfer of heat away from the sensor. Such heat transfer facilitates maintaining a sensor environment within the tolerance range of the sensor, thereby facilitating monitoring of the pressure fluctuation (or other sensor parameter) during operation of the aircraft.
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