Thermoelectric module
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United States of America Patent
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Sep 5, 1995
Grant Date -
N/A
app pub date -
Mar 8, 1994
filing date -
Mar 8, 1994
priority date (Note) -
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Abstract
A thermoelectric device using a pressed and sintered P-type semiconductor material connected to a crystalline N-type semiconductor material exhibits an unexpectedly high figure-of-merit, Z, and improved mechanical strength.
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