Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins
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United States of America Patent
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Sep 5, 1995
Grant Date -
N/A
app pub date -
Feb 8, 1994
filing date -
Apr 13, 1993
priority date (Note) -
Expired
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Abstract
A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resin mold process.
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