Printed wiring pattern
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United States of America Patent
Stats
-
Aug 29, 1995
Grant Date -
N/A
app pub date -
Dec 12, 1990
filing date -
Jul 19, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A printed wiring pattern for preventing poorly soldered connection that tends to occur when soldering surface mounting chip components and lead terminals of mounting components on the printed wiring pattern is capable of making the detection of a poorly soldered site a simple task.
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